Sansa, MarcArcamone, JulienVerd, JaumeUranga, ArantxaAbadal, GabrielNúria, BarniolSavu, Veronicavan den Boogaart, MarcBrugger, JürgenPerez-Murano, Francesc2011-07-052011-07-052011-07-05200910.1016/j.proche.2009.07.106https://infoscience.epfl.ch/handle/20.500.14299/69331A nanoelectromechanical mass sensor is used to characterize material deposition rates in stencil lithography. The material flux through micron size apertures is mapped with high spatial (below 1 μm) and deposition rate (below 10 pm/s) resolutions by displacing the stencil apertures over the sensor. The sensor is based on a resonating metallic beam (with submicron size width and thickness) monolithically integrated with a CMOS circuit, resulting in a CMOS/NEMS self-oscillator. The sensor is used to test alignment for multi-level nanostencil lithography.Nanomechanical mass sensorsCMOS sensorsnanostencil lithographynanolithographytext::conference output::conference proceedings::conference paper