Ballif, ChristophePerret, Laure-EmmanuelleLi, Hengyu2013-05-232013-05-23201310.5075/epfl-thesis-5742https://infoscience.epfl.ch/handle/20.500.14299/92361urn:nbn:ch:bel-epfl-thesis5742-9enPhotovoltaicsSolar CellSiliconModuleReliabilityEncapsulationGel contentAdhesionUV/VisGC-MSDSCResidual stressEVAPVBTPOGlassCuringCooling pressVoidOpen the Black Box : Understanding the Encapsulation Process of Photovoltaic Modulesthesis::doctoral thesis