Costa-Patry, EtienneThome, John Richard2013-02-272013-02-272013-02-27201210.1109/STHERM.2012.6188837https://infoscience.epfl.ch/handle/20.500.14299/89928WOS:000309172400020Hot-spots are present in micro-electronics and are challenging to cool effectively. Using a copper micro-evaporator mounted on a pseudo-chip, on-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on a flow pattern-based prediction method developed for uniform heat flux conditions, the experimental results could be well predicted.On-Chip Cooling of Hot-Spots with a Copper Micro-Evaporatortext::conference output::conference proceedings::conference paper