Costa-Patry, EtienneNebuloni, StefanoOlivier, JonathanThome, John Richard2012-03-152012-03-152012-03-15201210.1109/TCPMT.2011.2173572https://infoscience.epfl.ch/handle/20.500.14299/78814WOS:000300196600016Hot-spots are present in micro-electronics and are challenging to cool effectively. This paper presents highly nonuniform heat flux measurements obtained for a pseudo-CPU with 35 local heaters and temperature sensors cooled by a silicon multi-microchannel evaporator with 85 mu m wide and 560 mu m high channels separated by 46 mu m wide fins. A low pressure dielectric refrigerant, R245fa, was used as evaporating test fluid. The base heat flux was varied from 6 to 160 W/cm(2) and the junction temperature always remained below 65 degrees C, while the fluid inlet saturation temperature was 30.5 degrees C. On-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on analogous uniform heat flux tests made on the same test section, the effects of position, orientation size, and strength of the hot-spots were analyzed.Hot-spotsmicro-coolingnonuniform heat fluxrefrigerantsthermal managementtwo-phase flow coolingHeat-Transfer ModelFlowFluxR236Fatext::journal::journal article::research article