Savu, VeronicaKivioja, JaniAhopelto, JouniBrugger, Juergen2010-02-152010-02-15200910.1109/TASC.2009.2019075https://infoscience.epfl.ch/handle/20.500.14299/47407WOS:000268282000028This paper presents a resist-less process for parallel fabrication of sub-micrometer Al-AlOx-Al superconducting tunnel junctions. A custom stencil is fabricated containing 200 nm low stress SiN membranes with micro-apertures. The stencil is aligned and clamped with a 1 um accuracy to a substrate wafer containing Ti-Au contact electrodes. The junctions are fabricated by evaporating Al from two different angles, with an intermediate in-situ oxidation step. Measurements of the devices down to 0.3 K show stencil lithography is a good candidate for parallel, resist-less patterning of sub-micrometer area tunnel junctions. Challenges are addressed and further developments are proposed.Shadow maskstencil lithographySTJsuperconducting tunnel junction.text::journal::journal article::research article