Cadarso, V. J.Pfeiffer, K.Ostrzinski, U.Bureau, J. B.Racine, G. A.Voigt, A.Gruetzner, G.Brugger, J.2010-11-252010-11-25201010.1088/0960-1317/21/1/017003https://infoscience.epfl.ch/handle/20.500.14299/59121WOS:000285547800023The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems.MemsSu-8ResistAccelerometersPhotoresistFabricationtext::journal::journal article::research article