Hsu, Pei-ChengChen, Yu-ShengHwu, YeukuangJe, J. H.Margaritondo, G.Tok, Eng Soon2016-02-162016-02-162016-02-16201510.1107/S1600577515015234https://infoscience.epfl.ch/handle/20.500.14299/124172WOS:000364422100023X-ray irradiation is shown to trigger the deposition of Cu from solution, at room temperature, on a wide variety of insulating substrates: glass, passivated Si, TiN/Ti/SiO2/Si and photoresists like PMMA and SU-8. The process is suitable for patterning and the products can be used as seeds for electroplating of thicker overlayers.copper seed layerX-ray synthesismicro-patterningelectroless platingtext::journal::journal article::research article