Thome, John RichardMichel, BrunoMadhour, Yassir2014-08-252014-08-252014-08-25201410.5075/epfl-thesis-6323https://infoscience.epfl.ch/handle/20.500.14299/106038urn:nbn:ch:bel-epfl-thesis6323-5enelectronic packagingthermal management3D integrationchip stackingsolder bondingmicroscale flow boilingrefrigerants3D Integrated Architectures for Microelectronic Two-Phase Flow Cooling Applicationsthesis::doctoral thesis