Arnaud, L.Guillaumond, J.F.Claret, N.Cayron, C.Guedj, C.Dupeux, M.Arnal, V.Reimbold, G.Passemard, G.Torres, J.2014-11-142014-11-142014-11-14200610.1109/RELPHY.2006.251319https://infoscience.epfl.ch/handle/20.500.14299/108867Analysis of electromigration voiding phenomena in Cu interconnectstext::conference output::conference paper not in proceedings