Au-Sn Transient Liquid Phase Bonding for Microsystems Packaging

Herzig, Hans PeterBosshard, ChristianGiudice, Sandra2014-06-102014-06-10201410.5075/epfl-thesis-6109https://infoscience.epfl.ch/handle/20.500.14299/104153urn:nbn:ch:bel-epfl-thesis6109-9enPackaging of MicrosystemsFluxless BondingChip Scale Hermetic SealingGetter ActivationAu-Sn Transient Liquid Phase BondingAg-Au-Sn Transient Liquid Phase BondingHigh-Temperature ElectronicsAu-Sn Transient Liquid Phase Bonding for Microsystems Packagingthesis::doctoral thesis