RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integration

Gueye, R.Wee, S. W.Vitale, W. A.Truax, S.Akiyama, T.Roman, C.Ionescu, A.Hierold, C.Briand, D.de Rooij, N. F.2014-04-232014-04-232014-04-23201310.1109/Transducers.2013.6626895https://infoscience.epfl.ch/handle/20.500.14299/102939RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integrationtext::conference output::conference proceedings::conference paper