Arnaldo, IgnacioVincenzi, AlessandroRodrigo, AyalaLuis, JoséRisco, José L.Hidalgo, J. IgnacioRuggiero, MartinoAtienza Alonso, David2012-03-192012-03-192012-03-19201210.1109/LATW.2012.6261245https://infoscience.epfl.ch/handle/20.500.14299/78853Temperature-driven floorplaners have been recently proposed to alleviate the thermal problem in 3D multi-processor systems-on-chip (MPSoC). However, the proposed algorithms fail to provide fast placement of the modules when the complexity and the number of functional units in the stack increases. This paper proposes a fast and scalable CPU-GPU implementation of a multi-objective evolutionary algorithm that performs a thermal optimization of complex 3D MPSoCs, capable of obtaining optimal solutions in a reduced time. A comparative study shows that this work outperforms other proposals and reduces the computational time of the thermal optimization of complex architectures.3D-ICTherma-Aware DesignGPUtext::conference output::conference proceedings::conference paper