Ataman, CaglarLani, SébastienNoell, WilfriedJutzi, FabioBayat, Darade Rooij, Nico2011-02-082011-02-082011-02-08201110.1109/MEMSYS.2011.5734517https://infoscience.epfl.ch/handle/20.500.14299/64076WOS:000295841200170This paper reports a high fill-factor (>90%), 2-dimensional analog micromirror array designed specifically for very high, optically induced thermal load applications. Each pixel can attain a mechanical DC rotation angle of ±4 degrees around any arbitrary axis with 170V excitation. The maximum temperature rise on the mirror surface with 7 KW/m2 thermal load under 1 Pa ambient pressure is below 230 °C. A detailed assessment of the fabrication process –including the poly-Si vertical electrodes, wafer level mirror bonding, and copper electroplating of structural layers–, and characterization methodology is presented with experimental results.Fabrication and characterization of 3D integrated 2 DOF Micromirror Arrays for excessive thermal loadstext::conference output::conference proceedings::conference paper