Intrinsic, thermal and hygroscopic residual stresses in thin gas-barrier films on polymer substrates

Intrinsic, thermal, and hygroscopic contributions to the in-plane residual stress in silicon nitride films on polyimide substrates are identified, based on iso- hygric thermal ramps and isothermal relative humidity jumps, combined with non-linear elastic modeling of the resulting dynamics of film curvature. This approach enables the thermal and hygroscopic properties of thin nitride films to be determined and provides useful input for material and process control.


Published in:
Thin Solid Films, 515, 19, 7437-7441
Year:
2007
Keywords:
Laboratories:




 Record created 2007-01-23, last modified 2018-07-07


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