Effect of filler behavior on nanocomposite SU8 photoresist for moving micro- parts
Jiguet, Sébastien; Judelewicz, M.; Mischler, S.; Bertsch, Arnaud; Renaud, Philippe
2006

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Abstract

The use of low-stress SU8 nanocomposites as a functional material for micro- parts and coating applications is described in this paper. It was found that the nanoparticles lower the internal stress and decrease the wear rate and frictional coefficient of the SU8 epoxy. The applicability of this technology is demonstrated on gear wheels configuration and coating multilayer capping technology on moving micro-parts

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Title Effect of filler behavior on nanocomposite SU8 photoresist for moving micro- parts
Author(s) Jiguet, Sébastien ; Judelewicz, M. ; Mischler, S. ; Bertsch, Arnaud ; Renaud, Philippe
Published in Microelectronic Engineering
Volume 83
Pages 1273-1276
Date 2006
Keywords
DOI https://doi.org/10.1016/j.mee.2006.01.068
Other identifier(s) DAR: 8591
View record in Web of Science
Laboratories LMIS4
Record Appears in Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LMIS4 - Microsystems Laboratory 4
Peer-reviewed publications
Work produced at EPFL
Journal Articles
Published
Record creation date 2006-10-20

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