We present the first results from the upgraded version of the scanning photoemission spectromicroscope MAXIMUM, bared on synchrotron undulator fight and on a multilayer-coated Schwarzschild objective. The upgrade involved nearly all parts of the instrument, notably the beamline and the electron analysis system. Micro-images of Fresnel zone plates and of metal test patterns on semiconductor substrates reached a new record in lateral resolution, well beyond 0.1 micron. The first spectromicroscopy tests were also successfully performed on the new instrument, with analysis of f and d core levels in different systems.