High-Resolution X-Ray Microscopy Using an Undulator Source, Photoelectron Studies with Maximum

We present the first results of high-spatial resolution x-ray imaging studies with an upgraded version of the scanning photoemission multiple application x-ray imaging undulator microscope. The microscope is a multilayer coated Schwarzschild objective that focuses undulator radiation onto the sample. The recent upgrade improved the spatial resolution by a factor six reaching a full width at half maximum value of 0.5-mu-m. Highly polished mirrors reduced the diffuse background by almost two orders of magnitude and drastically improved the contrast. The improved microscope was used to perform a series of tests on microgrids and reverse Fresnel zone plates. The microscope capability to detect chemical and topological contrast was verified by using patterned metal overlayers on Si and GaAs substrates. Further improvements to increase the flux and the spatial resolution are underway; this includes the installation of a new undulator beamline.

Published in:
Journal of Vacuum Science & Technology a-Vacuum Surfaces and Films, 9, 3, 1248-1253
Ecole polytech fed lausanne,inst phys appl,ch-1007 lausanne,switzerland. univ calif berkeley lawrence berkeley lab,ctr xray opt,berkeley,ca 94720. Capasso, c, univ wisconsin,ctr xray lithog,3731 schneider dr,stoughton,wi 53589.
ISI Document Delivery No.: FR763
Part 2

 Record created 2006-10-03, last modified 2018-03-17

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