Low-temperature thick-film dielectrics and resistors for metal substrates
In this work, a set of low-temperature thick-film dielectrics consisting of two high-lead low-temperature glasses, stabilised by various amounts of alumina filler, is characterised on alumina and aluminium metal, as a function of firing temperature. Corresponding resistors based on the same glasses as the dielectrics, but with RuO2 as a conductive phase, were studied on the dielectrics. The purpose of these materials is to enable deposition of thick- film electronics onto substrates such as glass and metals (steel, aluminium, brass, titanium), which cannot be exposed to the standard high-temperature 850°C thick-film firing cycle. Satisfactory insulating properties were obtained, and the properties of the resulting resistors are promising, but managing thermal mismatch was found to be a major issue regarding the mechanical integrity.
Keywords: technologie des couches epaisses ; thick-film technology ; technologie hybride ; couches épaisses basse température ; substrats métalliques ; métaux ; aciers ; alliages aluminium ; Electrical properties ; Thermal expansion ; Glass ; Al2O3 ; Sensors ; couches épaisses
Première version des diélectriques basse température: encore pas très abouti en raison des problèmes d’ajustement du coefficient de dilatation thermique. (présenté à Electroceramics Cherbourg)
Record created on 2006-06-22, modified on 2016-08-08