Conference paper

Integrated thick-film hybrid microelectronics on aluminium substrates

In this work, a novel low-temperature thick-film system (dielectrics, resistors and conductors) is characterised for application on substrates, which cannot be exposed to the standard high-temperature 850 C thick-film firing cycle. Aluminium alloy sheets are ideal substrate materials for high power electronics, due to their excellent thermal dissipation, mechanical sturdiness, easy packaging and adjustable thermal expansion coefficient (Al-Si system). In addition to standard hybrid electronics, potential applications include heaters and mechanical sensors. This paper presents results of the electrical properties of the system : dielectric insulation, resistance, piezoresistance, stability.

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