Integrated thick-film hybrid microelectronics on aluminium substrates

In this work, a novel low-temperature thick-film system (dielectrics, resistors and conductors) is characterised for application on substrates, which cannot be exposed to the standard high-temperature 850 C thick-film firing cycle. Aluminium alloy sheets are ideal substrate materials for high power electronics, due to their excellent thermal dissipation, mechanical sturdiness, easy packaging and adjustable thermal expansion coefficient (Al-Si system). In addition to standard hybrid electronics, potential applications include heaters and mechanical sensors. This paper presents results of the electrical properties of the system : dielectric insulation, resistance, piezoresistance, stability.


Published in:
Proceedings, European Microelectronics and Packaging Symposium, Prague, 267-271, 2004., 267-271
Presented at:
European Microelectronics and Packaging Symposium, Prague (CZ), 16-18.6.2004
Year:
2004
Keywords:
Note:
Premiers résultats sur alu - pas encore terrible...
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2006-06-22, last modified 2018-01-27

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