Full tungsten and platinum nanoprobes for electrically conducting scanning probe methods

We have developed hybrid AFM probes with SU-8 polymer body and full platinum and tungsten cantilever and tip. The fabrication process uses surface micromachining of a (100) silicon wafer. The metal (platinum or tungsten) is sputter deposited in oxidation sharpened moulds, giving a final tip sharpness smaller than 20 nm. A SU-8 body is subsequently formed. The release is either done by a wet back-side or dry top-side process. The measured hardness of the tungsten and platinum film values 14.8 GPa and 7.3 GPa, respectively. Contact resistances on a gold sample show 25 Ohm and 10 Ohm for the tungsten and platinum probes, respectively. The results are promising for the development of a robust electrically conducting probe.


Presented at:
The 8th Korean MEMS Conference, Jeju, Korea, 6-8 April, 2006
Year:
2006
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2006-06-15, last modified 2018-03-17

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