We introduce two new low temperature bonding technologies for the assembly of microstructured glass substrates for the realisation of microchannels for miniaturised chemical analysis applications. A first method consists of a proper cleaning of the two glass surfaces, followed by a simple epoxy gluing process at 90°C. In a second method, direct bonding is obtained just by exposing the glass stack to a high pressure (up to 50 MPa) in the 100-200°C temperature range. We obtain bonding strengths as high as 10 MPa, higher than the best values obtained by HF-assisted or plasma-assisted bonding. For the realisation of the microchannels, we introduce, besides the well-known HF-etching technology, two simple alternative methods, namely, sawing and micropowder blasting.