Details
Title
Deformation and damage of a solder-copper joint
Author(s)
Tropea, P. ; Mellal, A.
Published in
Microelectronics Reliability
Volume
43
Issue
9
Pages
1791-1796
Date
2003
Other identifier(s)
View record in Web of Science
Laboratories
LMAF
Record Appears in
Scientific production and competences > STI - School of Engineering > IGM - Institute of Mechanical Engineering > LMAF - Laboratory of Applied Mechanics and Reliability Analysis
Peer-reviewed publications
Work produced at EPFL
Journal Articles
Published
Peer-reviewed publications
Work produced at EPFL
Journal Articles
Published
Record creation date
2005-09-14