000054082 001__ 54082
000054082 005__ 20190117192448.0
000054082 02470 $$2ISI$$a000189435200032
000054082 037__ $$aCONF
000054082 245__ $$aConductive SU8-silver composite photopolymer
000054082 260__ $$c2004
000054082 269__ $$a2004
000054082 336__ $$aConference Papers
000054082 490__ $$aPROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS WORKSHOP
000054082 520__ $$aA new electrically conductive photosensitive composite resist has been formulated and used to build microcomponents. This composite material is based on the SU-8 photopolymer, an insulating negative-tone photoresist, in which silver nano-particles have been dispersed to enhance the electrical properties of the polymer. The properties of this new photosensitive composite have been characterized by optical and electrical measurements. The patterned composite structures can be obtained for a wide range of values of the electrical conductivity, by varying the powder volume fraction of the composite. The lateral resolution of the produced structures were evaluated, and depending on the patterning conditions, can be better than 5 mum.
000054082 6531_ $$aepoxy-resin
000054082 6531_ $$apercolation
000054082 6531_ $$abehavior
000054082 6531_ $$athreshold
000054082 700__ $$0241613$$g140969$$aJiguet, Sébastien
000054082 700__ $$0240202$$g113143$$aBertsch, Arnaud
000054082 700__ $$0240408$$g105410$$aHofmann, H.
000054082 700__ $$0240219$$g107144$$aRenaud, Philippe
000054082 7112_ $$dJAN 25-29, 2004$$cMaastricht, NETHERLANDS$$a17th IEEE International Conference on Micro Electro Mechanical Systems
000054082 773__ $$tMEMS 2004: 17TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST$$q125-128
000054082 909CO $$pSTI$$ooai:infoscience.tind.io:54082$$pconf
000054082 909C0 $$0252064$$pLMIS4$$xU10324
000054082 937__ $$aLMIS4-CONF-2004-001
000054082 970__ $$aISIP:000189435200032/LMIS4
000054082 973__ $$rREVIEWED$$sPUBLISHED$$aEPFL
000054082 980__ $$aCONF