000054080 001__ 54080
000054080 005__ 20190316233523.0
000054080 0247_ $$2doi$$a10.1039/b310866j
000054080 02470 $$2DAR$$a5061
000054080 02470 $$2ISI$$a000221029900009
000054080 037__ $$aARTICLE
000054080 245__ $$aPolyimide and SU-8 microfluidic devices manufactured by heat- depolymerizable sacrificial material technique
000054080 269__ $$a2004
000054080 260__ $$c2004
000054080 336__ $$aJournal Articles
000054080 520__ $$aThe following paper describes a sacrificial layer method for the manufacturing of microfluidic devices in polyimide and SU-8. The technique uses heat-depolymerizable polycarbonates embedded in polyimide or SU-8 for the generation of microchannels and sealed cavities. The volatile decomposition products originating from thermolysis of the sacrificial material escape out of the embedding material by diffusion through the cover layer. The fabrication process was studied experimentally and theoretically with a focus on the decomposition of the sacrificial materials and their diffusion through the polyimide or SU-8 cover layer. It is demonstrated that the sacrificial material removal process is independent of the actual channel geometry and advances linearly with time unlike conventional sacrificial layer techniques. The fabrication method provides a versatile and fast technique for the manufacturing of microfluidic devices for applications in the field of muTAS and Lab-on-a-Chip.
000054080 6531_ $$atotal analysis systems
000054080 6531_ $$agas-permeability
000054080 6531_ $$afabrication
000054080 6531_ $$apolycarbonates
000054080 700__ $$0241614$$g131635$$aMetz, Stefan
000054080 700__ $$0241613$$g140969$$aJiguet, Sébastien
000054080 700__ $$0240202$$g113143$$aBertsch, Arnaud
000054080 700__ $$0240219$$g107144$$aRenaud, Philippe
000054080 773__ $$j4$$tLAB ON A CHIP$$k2$$q114-120
000054080 8564_ $$zURL
000054080 8564_ $$uhttps://infoscience.epfl.ch/record/54080/files/Metz%2704-LabChip.pdf$$zn/a$$s615933
000054080 909C0 $$xU10324$$0252064$$pLMIS4
000054080 909CO $$ooai:infoscience.tind.io:54080$$qGLOBAL_SET$$pSTI$$particle
000054080 937__ $$aLMIS4-ARTICLE-2004-005
000054080 970__ $$aISI:000221029900009/LMIS4
000054080 973__ $$rREVIEWED$$sPUBLISHED$$aEPFL
000054080 980__ $$aARTICLE