SU-8: a low-cost negative resist for MEMS

This paper describes the characterization of a home-made negative photoresist developed by IBM. This resist, called SU-8, can be produced with commercially available materials. Three blends were prepared for this article and some of its optical and mechanical properties are presented. One of its numerous advantages is the broad range of thicknesses which can be obtained in one spin: from 750 nm to 450 mu m with a conventional spin coater. The resist is exposed with a standard UV aligner and has an outstanding aspect ratio near 15 for lines and 10 for trenches. These ratios combined with the electroplating of copper allow the fabrication of highly integrated electromagnetic coils.


Publié dans:
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 7, 3, 121-124
Année
1997
Laboratoires:


Note: Le statut de ce fichier est: Seulement EPFL


 Notice créée le 2005-09-13, modifiée le 2018-03-17

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