SU-8: a low-cost negative resist for MEMS

This paper describes the characterization of a home-made negative photoresist developed by IBM. This resist, called SU-8, can be produced with commercially available materials. Three blends were prepared for this article and some of its optical and mechanical properties are presented. One of its numerous advantages is the broad range of thicknesses which can be obtained in one spin: from 750 nm to 450 mu m with a conventional spin coater. The resist is exposed with a standard UV aligner and has an outstanding aspect ratio near 15 for lines and 10 for trenches. These ratios combined with the electroplating of copper allow the fabrication of highly integrated electromagnetic coils.


Published in:
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 7, 3, 121-124
Year:
1997
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2005-09-13, last modified 2018-03-17

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