000053464 001__ 53464
000053464 005__ 20190812204829.0
000053464 02470 $$2ISI$$a000186761000168
000053464 037__ $$aCONF
000053464 245__ $$aModeling of cross-flow stack: sensitivity to thermal properties of the materials
000053464 260__ $$c2003
000053464 269__ $$a2003
000053464 336__ $$aConference Papers
000053464 490__ $$aProceedings of the Electrochemical Society$$v2003-07
000053464 500__ $$aEd. by S.C. Singhal, M. Dokiya
000053464 520__ $$aLENI activities in SOFC are focused on development of a new planar stack concept based on anode supported cells in collaboration with the company HTceramix SA. Modeling of repeat element, stack and systems is starting in parallel. This work presents a model of a SOFC stack in cross flow configuration. Concentrations, temperature and current density fields are computed, with a focus on sensitivity study for thermal parameters, while operating parameters are kept constant for the different cases. The main parameter considered was the thickness of the metallic interconnect and the related thermal conductivity. Stack height and cell size effects are presented as well. Importance of the temperature field on the design point and degradation behavior is briefly discussed.
000053464 6531_ $$amodeling sofc stack lenireactive
000053464 700__ $$0240491$$g102297$$aLarrain, Diego
000053464 700__ $$0240152$$g105085$$aFavrat, Daniel
000053464 700__ $$0240166$$g107971$$aVan herle, Jan
000053464 700__ $$g105292$$aGraetzel, Michael$$0240191
000053464 7112_ $$dApril 27 - May 2, 2003$$cParis
000053464 773__ $$tNone
000053464 8564_ $$zURL
000053464 8564_ $$zn/a$$uhttps://infoscience.epfl.ch/record/53464/files/LENI-2003-007.pdf$$s440824
000053464 909C0 $$xU10315$$pLENI$$0252044
000053464 909C0 $$pLPI$$0252060$$xU10101
000053464 909CO $$qGLOBAL_SET$$pconf$$pSTI$$pSB$$ooai:infoscience.tind.io:53464
000053464 937__ $$aLENI-CONF-2003-007
000053464 970__ $$aLENI-CONF-2003-007/LENI
000053464 973__ $$rREVIEWED$$sPUBLISHED$$aEPFL
000053464 980__ $$aCONF