000031975 001__ 31975
000031975 005__ 20180501105745.0
000031975 0247_ $$2doi$$a10.5075/epfl-thesis-1497
000031975 02471 $$2nebis$$a1644360
000031975 037__ $$aTHESIS_LIB
000031975 041__ $$aeng
000031975 088__ $$a1497
000031975 245__ $$aDevelopment of a new high-performance multichip-on-silicon packaging scheme
000031975 260__ $$aLausanne$$bEPFL$$c1996
000031975 269__ $$a1996
000031975 300__ $$a129
000031975 336__ $$aTheses
000031975 700__ $$aGuérin, Louis
000031975 720_2 $$aDutoit, Michel$$edir.
000031975 8564_ $$s5981936$$uhttps://infoscience.epfl.ch/record/31975/files/EPFL_TH1497.pdf$$yTexte intégral / Full text$$zTexte intégral / Full text
000031975 909CO $$ooai:infoscience.tind.io:31975$$pDOI2$$pDOI$$pthesis
000031975 920__ $$b1996
000031975 970__ $$a1497/THESES
000031975 973__ $$aEPFL$$sPUBLISHED
000031975 980__ $$aTHESIS