Thermal Design of a Medium Voltage Modular Multilevel Converter Cell
Frei, Yanick Patrick; Dujic, Drazen
2023

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Abstract

This paper presents the cooling concept for a medium voltage modular multilevel converter cell. To optimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below desired levels. Design, simulation results, and several different prototypes are verified and validated experimentally for their performance.

Details

Title Thermal Design of a Medium Voltage Modular Multilevel Converter Cell
Author(s) Frei, Yanick Patrick ; Dujic, Drazen
Published in Power Electronics and Applications (EPE’23 ECCE-Europe), 2023 25th European Conference on. Proceedings
Conference The 25th Conference on Power Electronics and Applications, EPE ’23 ECCE Europe, Aalborg, Denmark, September, 04 – 08, 2023
Date 2023
Publisher New York, IEEE
ISBN 978-9-0758-1541-2
Keywords
DOI https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264448
Other identifier(s) View record in Web of Science
Laboratories PEL
Record Appears in Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > PEL - Power Electronics Laboratory
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Record creation date 2023-09-12

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