A manifold microchannel heat sink for ultra-high power density liquid-cooled converters


Published in:
Proceedings of the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 1383-1389
Presented at:
2019 IEEE Applied Power Electronics Conference and Exposition (APEC)
Year:
May 27 2019
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 Record created 2019-06-30, last modified 2019-08-12

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