Details
Title
Xu, Hu
Sciper ID
183772
Publications
Analytical Heat Transfer Model for Thermal Through-Silicon Vias
Effects of Process Variations on 3-D Global Clock Distribution Networks
Enhanced Wafer Matching Heuristics for 3-D ICs
Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations
Process-induced skew variation for scaled 2-D and 3-D ICs
Repeater Insertion for Two-Terminal Nets in Three-Dimensional Integrated Circuits
Skew Variability in 3-D ICs with Multiple Clock Domains
Synchronization and Power Integrity Issues in 3-D ICs
The Combined Effect of Process Variations and Power Supply Noise on Clock Skew and Jitter
Timing Uncertainty in 3-D Clock Trees due to Process Variations and Power Supply Noise
Effects of Process Variations on 3-D Global Clock Distribution Networks
Enhanced Wafer Matching Heuristics for 3-D ICs
Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations
Process-induced skew variation for scaled 2-D and 3-D ICs
Repeater Insertion for Two-Terminal Nets in Three-Dimensional Integrated Circuits
Skew Variability in 3-D ICs with Multiple Clock Domains
Synchronization and Power Integrity Issues in 3-D ICs
The Combined Effect of Process Variations and Power Supply Noise on Clock Skew and Jitter
Timing Uncertainty in 3-D Clock Trees due to Process Variations and Power Supply Noise
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Xu, H
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