Active films and processes for depositing the same onto a complex 3D shape substrates and implants are provided. The process comprises the following steps: inserting into a process chamber a sputtering target, including at least two chemical elements and a complex shape 3D substrate on a substrate holder, providing a gas to be ionized into the process chamber with a controlled pressure; applying a voltage in pulse between the sputtering target and the complex shape 3D substrate; and generating a magnetic field at the surface of the sputtering target inside the process chamber as required for HIPIMS.