000228106 001__ 228106
000228106 005__ 20181221101922.0
000228106 013__ $$d20161110$$bUS$$cA1$$aUS2016327743
000228106 02470 $$2EPO Family ID$$a57221860
000228106 02470 $$2TTO$$a6.1485
000228106 037__ $$aPATENT
000228106 245__ $$aWaveguide Fabrication Method
000228106 269__ $$a2016
000228106 260__ $$c2016
000228106 336__ $$aPatents
000228106 520__ $$aA waveguide fabrication method including the steps of providing a substrate including at least one waveguide recess structure and a stress release recess structure for receiving a waveguide material, and depositing the waveguide material onto the substrate and into both the waveguide recess structure and the stress release recess structure.
000228106 700__ $$0244694$$g182444$$aKippenberg, Tobias
000228106 700__ $$0247648$$g203731$$aPfeiffer, Martin Hubert Peter
000228106 700__ $$aKordts, Arne$$g224397$$0248692
000228106 909C0 $$xU10021$$0252085$$pTTO
000228106 909C0 $$0252348$$pLPQM
000228106 909CO $$pSTI$$pSB$$ooai:infoscience.tind.io:228106
000228106 917Z8 $$x222695
000228106 937__ $$aEPFL-PATENT-228106
000228106 973__ $$aEPFL
000228106 980__ $$aPATENT