We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.
Titre
Die Level Release of Silicon Photonic MEMS
Publié dans
2016 International Conference On Optical Mems And Nanophotonics (OMN)
Pagination
2
Série
International Conference on Optical MEMS and Nanophotonics
Présenté à
International Conference on Optical MEMS and Nanophotonics (OMN)
Date
2016
Editeur
New York, IEEE
ISSN
2160-5033
ISBN
978-1-5090-1035-6
Date de création de la notice
2017-01-24