We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.
Title
Die Level Release of Silicon Photonic MEMS
Published in
2016 International Conference On Optical Mems And Nanophotonics (OMN)
Pagination
2
Series
International Conference on Optical MEMS and Nanophotonics
Conference
International Conference on Optical MEMS and Nanophotonics (OMN)
Date
2016
Publisher
New York, IEEE
ISSN
2160-5033
ISBN
978-1-5090-1035-6
Record creation date
2017-01-24