Die Level Release of Silicon Photonic MEMS

We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.


Published in:
2016 International Conference On Optical Mems And Nanophotonics (OMN)
Presented at:
International Conference on Optical MEMS and Nanophotonics (OMN)
Year:
2016
Publisher:
New York, IEEE
ISSN:
2160-5033
ISBN:
978-1-5090-1035-6
Keywords:
Laboratories:




 Record created 2017-01-24, last modified 2018-03-17


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