Methods and systems for power-efficient inductive chip-to-chip communications

Digital information is communicated between stacked integrated circuit devices by inductive coupling between arrays of inductors formed from integrated circuit wiring layers. This can be done using a combination of push-pull drivers, common inductor return legs, and balanced sparse ternary encoding. Embodiments result in low power utilization and high pin efficiency.


Year:
2015
Keywords:
Patent number(s):
Laboratories:




 Record created 2016-12-14, last modified 2018-03-17

External link:
Download fulltext
URL
Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)