Spice Simulation of Passive Protection in Smart Power ICs

When designing in Smart Power technologies, TCAD simulations are mandatory to design effective passive protections against parasitic couplings due to minority carriers. The objective of this paper is to propose a spice-based approach to characterize electrical key parameters of a passive protection directly within standard IC design flow avoiding time consuming TCAD simulations. Our methodology consists in integrating a new substrate model in spice to enable designers to derive themselves process specific design rules and reduce substrate couplings. This methodology enables designers to access valuable results in the early stage of IC design, where before such results could be obtained only in the final verification step.


Published in:
2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (Mixdes), 500-503
Presented at:
22nd International Conference on Mixed Design of Integrated Circuits & Systems (MIXDES), Torun, Poland, JUN 25-27, 2015
Year:
2015
Publisher:
New York, Ieee
ISBN:
978-83-63578-06-0
Keywords:
Laboratories:




 Record created 2015-12-02, last modified 2018-03-17


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