Through Silicon Vias and thermocompression bonding using inkjet-printed gold nanoparticles for heterogeneous MEMS integration

We present a novel technique for heterogeneous integration using gold filled Through Silicon Vias (TSV) and thermocompression bond bumps formed in a single fabrication step, using gold nanoparticles dispensed by inkjet printing. Gold-filled TSV arrays (12 × 12, via radius 50μm, pitch 250μm) have been demonstrated using this method. Void free, filled TSVs are reported, and thermocompression bonding yielded seamless interfaces. Die shear tests show good bond strength, and sub-Ω via resistances were measured. The presented integration process exhibits a low temperature budget (≤250°C), allows good alignment, and is compatible with substrates of different sizes and materials, enabling the heterogeneous integration of known-good-dies (KGD) which may have been fabricated in different technologies.


Published in:
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 834-837
Presented at:
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), Barcelona, Spain, June 16-20, 2013
Year:
2013
Publisher:
IEEE
Laboratories:




 Record created 2015-07-09, last modified 2018-03-17


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