000209892 001__ 209892
000209892 005__ 20180913063211.0
000209892 037__ $$aPOST_TALK
000209892 245__ $$aDroplet-on-Demand Inkjet-filled TSVs as a Pathway to Cost-efficient Chip Stacking
000209892 269__ $$a2013
000209892 260__ $$c2013
000209892 336__ $$aTalks
000209892 700__ $$aSadie, Jacob
000209892 700__ $$0249161$$g136108$$aQuack, Niels
000209892 700__ $$aWu, Ming C.
000209892 700__ $$aSubramanian, Vivek
000209892 7112_ $$d30 September – 3 October, 2013$$cOrlando, FL, USA$$aIMPAS 2013, 46th International Symposium on Microelectronics
000209892 909C0 $$xU13060$$0252536$$pQ-LAB
000209892 909CO $$pSTI$$ppresentation$$ooai:infoscience.tind.io:209892
000209892 917Z8 $$x144315
000209892 937__ $$aEPFL-TALK-209892
000209892 973__ $$aOTHER
000209892 980__ $$aTALK