Thermocompression assembling device used to connect together a wire with an IC

The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the support body, and its tip projecting freely. The diamond is fastened by a system which avoids the diamond becoming unseated as a result of different thermal expansion of the diamond and base material. This may comprise a seating in the block which is also conical in shape, or may comprises a welding material (5) surrounding the base of the cone, within a recess formed in the block. Materials are chosen such that their respective degrees of thermal expansion do not allow the diamond to become loose when the device is heated.

European Patent Office
Other identifiers:
EPO Family ID: 9551901
Patent number(s):

 Record created 2014-12-18, last modified 2019-03-17

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