000203475 001__ 203475
000203475 005__ 20180317093356.0
000203475 0247_ $$2doi$$a10.1111/j.1460-2695.2006.01037.x
000203475 022__ $$a8756-758X
000203475 037__ $$aARTICLE
000203475 245__ $$aAtomistic simulation of tensile strength and toughness of cracked Cu nanowires
000203475 260__ $$bWiley-Blackwell$$c2006
000203475 269__ $$a2006
000203475 336__ $$aJournal Articles
000203475 520__ $$aVirtual tensile experiments on cylindrical copper wires of nanometric diameter were carried out using molecular dynamics techniques based on the embedded-atom method. Transverse, atomically sharp surface cracks with circular fronts of different depths are introduced to evaluate their effect on the mechanical strength of the nanowires. The axisymmetric z-axis of the specimen is on the 001 direction of the nanowires. The analysis shows that, at 0 K, the cracked Cu nanowires behave in a ductile manner, their strength being determined by dislocation or twinning nucleation from the crack tip. Their calculated fracture toughness ranges from 0.6 to 3 MPa√m.
000203475 700__ $$0246479$$aLuque Gomez, Aitor$$g222139
000203475 700__ $$aAldazabal, J.
000203475 700__ $$aMartinez-Esnaola, J. M.
000203475 700__ $$aSevillano, J. Gil
000203475 773__ $$j29$$k8$$q615-622$$tFatigue and Fracture of Engineering Materials and Structures
000203475 909CO $$ooai:infoscience.tind.io:203475$$particle$$pSTI
000203475 909C0 $$0252446$$pIGM$$xU10306
000203475 917Z8 $$x222139
000203475 917Z8 $$x222139
000203475 937__ $$aEPFL-ARTICLE-203475
000203475 973__ $$aOTHER$$rREVIEWED$$sPUBLISHED
000203475 980__ $$aARTICLE