000203378 001__ 203378
000203378 005__ 20181203023706.0
000203378 0247_ $$2doi$$a10.1016/j.fusengdes.2007.03.031
000203378 022__ $$a09203796
000203378 037__ $$aARTICLE
000203378 245__ $$aExamination of Be//Cu joints in hipped Be tiles by using Ion Beam Analysis methods
000203378 260__ $$c2007
000203378 269__ $$a2007
000203378 336__ $$aJournal Articles
000203378 520__ $$aBe has a tendency to form particularly brittle intermetallics with Cu and a lot of other elements. Insertion of interlayers may be a solution to increase bond quality. Ion Beam Analysis (IBA) methods have been considered together with scanning electron microscopy (SEM) and electron back-scattering diffraction (EBSD) as complementary techniques for the characterization of the Be//Cu junction. The following work aims at demonstrating how such techniques (used in micro-beam mode) coupled with SEM/EBSD data, can bring valuable information in this area. Interlayer-free mock-ups reveal intermetallics which are mainly BeCu (apparently mixed with lower quantities of BeCu2 compound). While Cr or Ti interlayers seem to behave as good Be diffusion barriers preventing the formation of BeCu, they strongly interact with Cu to form CuTi2 or Cr2Ti intermetallics. In the case of Cr, Be seems to be incorporated into the Cr layer. © 2007 Elsevier B.V. All rights reserved.
000203378 6531_ $$aBeryllium
000203378 6531_ $$aBrittle intermetallics
000203378 6531_ $$aBrittleness
000203378 6531_ $$aCopper
000203378 6531_ $$aDiffusion barriers
000203378 6531_ $$aElectron back-scattering diffraction (EBSD)
000203378 6531_ $$aInterlayers
000203378 6531_ $$aIntermetallics
000203378 6531_ $$aIon Beam Analysis
000203378 6531_ $$aIon beams
000203378 6531_ $$aJoints (structural components)
000203378 6531_ $$aNuclear Reaction Analysis
000203378 6531_ $$ascanning electron microscopy
000203378 700__ $$aDe Vito, E.
000203378 700__ $$aKhodja, H.
000203378 700__ $$0248450$$g112215$$aCayron, C.
000203378 700__ $$aLorenzetto, P.
000203378 773__ $$j82$$tFusion Engineering and Design$$q1671-1680
000203378 909C0 $$xU12903$$0252516$$pLMTM
000203378 909CO $$pSTI$$particle$$ooai:infoscience.tind.io:203378
000203378 937__ $$aEPFL-ARTICLE-203378
000203378 973__ $$rREVIEWED$$sPUBLISHED$$aOTHER
000203378 980__ $$aARTICLE