Applications of dry photoresist film for printed and flexible electronics

This work presents three applications of dry photoresist film for printed and flexible electronics devices. First, as part of the flexible encapsulation of printed gas sensors (i.e. humidity). This process was performed at relatively low temperatures (85 °C) and was shown to be mechanically robust. Second, as mechanical protection layer of printed circuitry to increase the robustness to bending forces and protect against environmental-induced wear. Mechanical robustness was increased by optimizing the neutral plane position. Third, as integration and interconnection layer of SMD components on foil. The electrical interconnections are realized using conductive adhesive filled-vias through the dry film, which is also used for mechanical fixation of the components.


Presented at:
LOPE 2013, Munich, Germany, June 11-13, 2013
Year:
2013
Laboratories:




 Record created 2014-09-16, last modified 2018-09-13


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