T0004 / Soldering wires to sensor contact pads

The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can damage contact pad metallisations and alter the sensor characteristics. This document details how to safely solder wires onto the pre-tinned contact pads of MilliNewton B sensors (figure 1), which have been designed to be relatively tolerant to this process step. This procedure is also applicable to similar products.


Year:
2008
Publisher:
Lausanne - Écublens, EPFL
Keywords:
Laboratories:




 Record created 2014-07-16, last modified 2018-01-28

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