RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integration
2013
Details
Title
RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integration
Author(s)
Gueye, R. ; Wee, S. W. ; Vitale, W. A. ; Truax, S. ; Akiyama, T. ; Roman, C. ; Ionescu, A. ; Hierold, C. ; Briand, D. ; de Rooij, N. F.
Published in
Proceedings of Transducers 2013
Volume
1
Pages
830-833
Conference
Transducers 2013, Barcelona, Spain, June 17-20, 2013
Date
2013
Laboratories
SAMLAB
Record Appears in
Scientific production and competences > STI - School of Engineering > STI Archives > SAMLAB - Sensors, Actuators and Microsystems Laboratory
Conference Papers
Work produced at EPFL
Published
Conference Papers
Work produced at EPFL
Published
Record creation date
2014-04-23