RF-TSVs COMPATIBLE WITH HARSH-ENVIRONMENT POST-PROCESSING FOR “VIA-FIRST” 3D INTEGRATION


Published in:
Proceedings of Transducers 2013, 1, 830-833
Presented at:
Transducers 2013, Barcelona, Spain, June 17-20, 2013
Year:
2013
Laboratories:




 Record created 2014-04-23, last modified 2018-09-13


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