3D serial TSV link for low-power chip-to-chip communication
2014
Details
Title
3D serial TSV link for low-power chip-to-chip communication
Author(s)
Beanato, Giulia ; Cevrero, Alessandro ; De Micheli, Giovanni ; Leblebici, Yusuf
Published in
2014 IEEE International Conference on IC Design & Technology
Conference
2014 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT), Austin, Texas, USA, March 26, 2014
Date
2014
Record Appears in
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSI2 - Integrated Systems Laboratory (STI/IC)
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSM - Microelectronic Systems Laboratory
Conference Papers
Work produced at EPFL
Published
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSM - Microelectronic Systems Laboratory
Conference Papers
Work produced at EPFL
Published
Record creation date
2014-04-07