Wafer-level micro-structuring of glassy carbon

Glassy carbon is used nowadays for a variety of applicationsbecause of its mechanical strength, thermal stability and non-sticking adhesion properties. One application is glass molding that allows to realize high resolution diffractive optical elements on large areas and at affordable price appropriate for mass production. We study glassy carbon micro-structuring for future precision compression molding of low and high glass-transition temperature. For applications in optics the uniformity, surface roughness, edge definition and lateral resolution are very important parameters for a stamp and the final product. We study different methods of microstructuring of glassy carbon by etching and milling. Reactive ion etching with different protection layers such as photoresists, aluminium and titanium hard masks have been performed and will be compare with Ion beam etching. We comment on the quality of the structure definition and give process details as well as drawbacks for the different methods. Inour fabrications we were able to realize optically flat diffractive structures with slope angles of 80° at typical feature sizes of 5 micron and 700 nm depth qualified for high precision glass molding.


Published in:
Proc. SPIE, 8974, 89740 (2014)
Presented at:
Photonics West 2014, San Francisco, California, USA, February 1-6, 2014
Year:
2014
Publisher:
Bellingham, Spie-Int Soc Optical Engineering
ISBN:
978-0-8194-9887-8
Keywords:
Laboratories:




 Record created 2014-03-17, last modified 2018-09-13

n/a:
Download fulltext
PDF

Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)