000195392 001__ 195392
000195392 005__ 20190316235823.0
000195392 0247_ $$2doi$$a10.1016/j.mee.2013.07.016
000195392 022__ $$a0167-9317
000195392 02470 $$2ISI$$a000327293500023
000195392 037__ $$aARTICLE
000195392 245__ $$aMicro-fabrication of high-thickness spiral inductors for the remote powering of implantable biosensors
000195392 269__ $$a2014
000195392 260__ $$aAmsterdam$$bElsevier$$c2014
000195392 300__ $$a6
000195392 336__ $$aJournal Articles
000195392 520__ $$aA micro-fabrication process is proposed to realize high-thickness spiral inductors for the remote powering of implantable biosensors through inductive link. The process is suitable for different substrates, such as silicon and Pyrex, and enables the fabrication of the receiving inductor directly on the implantable system. The use of Ordyl Alpha960 is explored to achieve high-thickness structures. Ordyl is a dry film, negative photoresist that enables high-thickness mold (starting from 60 p.m) with a single-layer deposition. Copper spiral inductors with a trace thickness of 60 pm are fabricated on silicon and tested. These inductors can receive up to 8.7 mW, with a link efficiency of 25%, over a distance of 6 mm from the transmitter. Tested within a real setup, these inductors enable bidirectional data communication with the external transmitter. Downlink communication (ASK) is successfully tested at 100 kbps. Uplink communication (LSK) is successfully tested at 66.6 kbps. (C) 2013 Elsevier B.V. All rights reserved.
000195392 6531_ $$aHigh-thickness inductors
000195392 6531_ $$aInductive link
000195392 6531_ $$aRemote powering
000195392 6531_ $$aImplantable biosensors
000195392 6531_ $$aOrdyl
000195392 700__ $$0242419$$aOlivo, Jacopo$$g183208
000195392 700__ $$0242413$$aCarrara, Sandro$$g182237
000195392 700__ $$0240269$$aDe Micheli, Giovanni$$g167918
000195392 773__ $$j113$$q130-135$$tMicroelectronic Engineering
000195392 8564_ $$s1233702$$uhttps://infoscience.epfl.ch/record/195392/files/1-s2.0-S0167931713005650-main.pdf$$yn/a$$zn/a
000195392 909C0 $$0252283$$pLSI1$$xU11140
000195392 909CO $$ooai:infoscience.tind.io:195392$$particle$$pSTI$$pIC$$qGLOBAL_SET
000195392 917Z8 $$x112915
000195392 937__ $$aEPFL-ARTICLE-195392
000195392 973__ $$aEPFL$$rREVIEWED$$sPUBLISHED
000195392 980__ $$aARTICLE