1) Introduction 2) Common technological issues 3) Devices 4) Microreactors & mixers - shaping of LTCC 5) Membranes & “resistors” - C sacrificial layers 6) Force sensors - shaping of LTCC 7) Conclusions
Title
Structuration of LTCC for integrated fluidics and micromechanical devices
Conference
1st MacroNano Colloquium on LTCC RF- and Microsystem Interconnect, Ilmenau, Germany, 29-30.11.2006
Date
2006
Note
Présentation invitée - méthodes de structuration 3D du LTCC Invited talk - 3D structuration methods for LTCC
Record creation date
2013-11-12