Structuration of LTCC for integrated fluidics and micromechanical devices

1) Introduction 2) Common technological issues 3) Devices 4) Microreactors & mixers - shaping of LTCC 5) Membranes & “resistors” - C sacrificial layers 6) Force sensors - shaping of LTCC 7) Conclusions


Presented at:
1st MacroNano Colloquium on LTCC RF- and Microsystem Interconnect, Ilmenau, Germany, 29-30.11.2006
Year:
2006
Keywords:
Note:
Présentation invitée - méthodes de structuration 3D du LTCC Invited talk - 3D structuration methods for LTCC
Laboratories:




 Record created 2013-11-12, last modified 2018-09-13

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